Sputtering process
![](https://www.elettrorava.com/wp-content/uploads/2023/10/detail4.png)
![](https://www.elettrorava.com/wp-content/uploads/2023/10/glyph1.png)
Magnetron Sputtering
MS
Magnetron sputtering is a versatile deposition technique used to create thin films on a substrate surface by sputtering atoms or molecules from a target material. It offers a good deposition rate and the ability to deposit a wide range of materials including metals, dielectrics, and semiconductors. In this process, an Argon plasma is ignited above a negatively biased and magnetized target material, drawing ions from the plasma towards the target material. As a result, Argon ions impact the target, causing atoms or molecules to be ejected from the surface through a process known as sputtering. The sputtered material forms a vapour that condenses on the substrate surface, resulting in the formation of a thin film
![](https://www.elettrorava.com/wp-content/uploads/2023/10/ER_Magnetron_Sputtering_Chamber_6931-768x768.jpg)
Applications
Magnetron sputtering can be used to deposit to create optical antireflective coatings, anticorrosive coatings, IR optics, dental protheses, and super-insulation. This deposition method is also employed in microelectronics for producing metal film capacitors, optical data storage, and microprocessors, as well as in the consumer industry for manufacturing anti-reflective coatings
- Consumer Electronics
- Automotive Industry
- Solar Energy
- Aerospace and defence
- Healthcare and medical devices
- Optics and photonics
- Surface engineering
Key features
- Single, vertical coplanar, confocal or linear configuration sources can be combined for DC, DC pulsed, RF, HIPIMS
- Co-sputtering configuration
- Reactive gases (02 , N2 , etc) can be added for direct reaction during deposition process
- Integrated quartz crystal controller for thickness monitoring
- Optional automatic or manual load lock (optional pre-heating and/or plasma treatments)
- Optional wide range optical thickness monitor for the control of layer thickness for a large number of layers by T% or R% monitoring on the coated substrates
- Software interface for real time deposition monitoring
Deposited materials
Metals, Oxides, Nitrides, Carbides, Semiconductors, Carbon Based Materials
Similar technologies
![](https://www.elettrorava.com/wp-content/uploads/2023/10/border1.png)
Magnetron Sputtering
a robust solution enabling the widest range of deposited materials
![](https://www.elettrorava.com/wp-content/uploads/2023/10/border2.png)
![System](https://www.elettrorava.com/wp-content/uploads/elementor/thumbs/ER_Magnetron_Sputtering__104437-qe4uleowymc4t2l2rw7ljzi3v29dd6xfbwnu6t6idw.jpg)
![Deposition](https://www.elettrorava.com/wp-content/uploads/elementor/thumbs/ER_Magnetron_Sputtering__7123-qe4uldr2rsauhgmfxdsyzhqn9oe05htozs0cpj7wk4.jpg)
![Chamber](https://www.elettrorava.com/wp-content/uploads/elementor/thumbs/ER_Magnetron_Sputtering__1560-qe4ulct8ky9k5unt2vecezz6oaimxspynncv899aqc.jpg)
![ER_Magnetron_Sputtering__1530](https://www.elettrorava.com/wp-content/uploads/elementor/thumbs/ER_Magnetron_Sputtering__1530-qe4ulbvee489u8p68czpui7q2wn9q3m8bipdqzaowk.jpg)