Sputtering process

Magnetron Sputtering


Magnetron sputtering is a versatile deposition technique used to create thin films on a substrate surface by sputtering atoms or molecules from a target material. It offers a good deposition rate and the ability to deposit a wide range of materials including metals, dielectrics, and semiconductors. In this process, an Argon plasma is ignited above a negatively biased and magnetized target material, drawing ions from the plasma towards the target material. As a result, Argon ions impact the target, causing atoms or molecules to be ejected from the surface through a process known as sputtering. The sputtered material forms a vapour that condenses on the substrate surface, resulting in the formation of a thin film


Magnetron sputtering can be used to deposit to create optical antireflective coatings, anticorrosive coatings, IR optics, dental protheses, and super-insulation. This deposition method is also employed in microelectronics for producing metal film capacitors, optical data storage, and microprocessors, as well as in the consumer industry for manufacturing anti-reflective coatings

Key features

Deposited materials

Metals, Oxides, Nitrides, Carbides, Semiconductors, Carbon Based Materials

Similar technologies

Full catalog download

Click to download our Thin Film Equipment Catalog

Magnetron Sputtering

a robust solution enabling the widest range of deposited materials

Not found what you are looking for? Take a look to our other technologies

Physical Vapor Deposition

Chemical Vapor Deposition