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      • Thermal Evaporation – TE
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      • Ion Beam Assisted Deposition – IBAD
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      • Thermal Low Pressure CVD – LPCVD
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      • Atomic Layer Deposition – ALD
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      • Reactive Ion Etching – RIE
      • Inductive Coupled Plasma RIE – ICPRIE
      • Ion Beam Etching – IBE
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  • About us
    • Elettrorava History
    • Research projects
  • Technologies
    • PVD process
      • Thermal Evaporation – TE
      • Electron Beam Evaporation – EBPVD
    • Sputtering process
      • Magnetron Sputtering – MS
      • Ion Beam Sputtering – IBS
      • Ion Beam Assisted Deposition – IBAD
    • CVD process
      • Thermal Low Pressure CVD – LPCVD
      • Metalorganic Chemical Vapor Deposition – MOCVD
      • Atomic Layer Deposition – ALD
      • Plasma Enhanced CVD – PECVD
      • Inductively Coupled Plasma CVD – ICPCVD
    • Etching process
      • Reactive Ion Etching – RIE
      • Inductive Coupled Plasma RIE – ICPRIE
      • Ion Beam Etching – IBE
  • Contact us
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