Sputtering Deposition Systems

• Magnetron sputtering is a versatile technique extensively used for the deposition of a wide range of materials such as insulators, metals, semiconductors. One or more magnetron cathodes of several sizes can be used in a system for deposition of multilayers of different materials or for codeposition. Both RF and DC generators are available for plasma excitation depending upon the application. The system is normally equipped with a turbomolecular pump of suitable pumping speed to evacuate the chamber to the high vacuum or ultra high vacuum range.
  A sputtering chamber can be readily integrated as one of the process chambers of a multichamber system.