How big is your wafer?

New multichamber PECVD machine

We report on work progress on a new modular multichamber PECVD system for deposition on 35cm x 32cm substrates designed and manufactured for TNO (The Netherlands).

The system is designed to prevent incorporation of residual impurities and cross contamination between different layers.

Wide range of deposited materials is as follows:

intrinsic and doped a-Si:H
intrinsic and doped μ-Si:H
Silicon alloys such as SixCy:H, SixNy:H, SixOy:H

The system is now operational at our factory in Italy and extensive testing is under way.